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1.5 W / M * K Conductive Silicone Pad For Heat Sink Chip Cooling Heatsink

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1.5 W / M * K Conductive Silicone Pad For Heat Sink Chip Cooling Heatsink

Brand Name : Trumonytechs

Model Number : 301-0200

Certification : SGS ,ISO9001

Place of Origin : China

MOQ : 500pcs

Price : 2.25

Payment Terms : L/C, D/A, D/P, D/P, T/T, Western Union, MoneyGram

Supply Ability : 1000pcs/day

Packaging Details : cartons

Name : Conductive Silicone Pad

Thermal Conductivity : 1.5-12 W/m*K

Application : EV Battery Pack

Hardness : 5~80Shore 00

Density : 1.8-3.5g/cc

Voltage Resistance : 6-10 KV/mm

Volume Resistivity : 10^12 Ω*cm

Flame Rating : V0 UL-94

color : Gray/Customize

Feature : insulation

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1.5 W / M * K Conductive Silicone Pad For Heat Sink Chip Cooling Heatsink

Discription of Conductive Silicone Pad​:

Conductive Silicone Pad is a kind of thermal conductive medium material synthesized by special process with silica gel as the base material and various auxiliary materials such as metal oxide.
Conductive Silicone Pad has a certain degree of flexibility, excellent insulation, compressibility, natural viscosity of the surface, specially for the use of gap heat transfer design scheme production, can fill the gap, complete the heat transfer between the heating part and the heat dissipation part, but also play the role of insulation, shock absorption, can meet the equipment miniaturization and ultra-thin design requirements, is very technological and usability. Conductive Silicone Pad is an excellent thermal conductive filling material and is widely used in electronic and electrical products.

Technological Parameters:

Conductive Silicone Pad Pads Series
Item No.

Thermal Conductivity

(W/m*K)

Hardness

(Shore 00)

Density

(g/cc)

Voltage

Resistance

(KV/MM)

Volume

Resistivity

(Ω*cm)

Flame Rating

(UL-94)

301-01501.55~801.81010^12V0
301-020025~8021010^12V0
301-0300315~803.0810^12V0
301-0400415~803.3810^12V0
301-0600620~803.5810^12V0
301-0800830~803.6810^12V0
301-10001030~803.3610^12V0
301-12001230~803.2610^12V0


Application of Conductive Silicone Pad​:

1.5 W / M * K Conductive Silicone Pad For Heat Sink Chip Cooling Heatsink
Advantages of Conductive Silicone Pad​​:


1, The main purpose of the selection of Conductive Silicone Pad to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat dissipation device, Conductive Silicone Pad can fill the gap of the contact surface well;

2, The air is a bad conductor of heat will seriously hinder the transfer of heat between the contact surface, and the heat transfer Conductive Silicone Pad between the heat source and the radiator can squeeze the air out of the contact surface;

3, With the supplement of heat-conducting Conductive Silicone Pad, can make the contact surface between the heat source and the radiator better and full contact, really face-to-face contact, so that the reaction on the temperature can be as small as possible.

FAQ


A)How could I get a sample?
Before we received the first order, please afford the sample cost and express fee. We will return the sample cost back to you within your first order.
B)Sample time?
Usually within 10-30 days.
C) Whether you could make our brand on your products?
Yes. We can print your Logo on both the conductive Silicone Pad and the packages if you can meet our MOQ.
D) Whether you could make your products by our color?
Yes, The color of products can be customized if you can meet our MOQ,and pls send the color chart.
E) How to guarantee the quality of Conductive Silicone Pad​ ?
1) Strict detection during production.
2) Strict sampling inspection on products before shipment and intact product packaging ensured.
F) : Do you accept R & D assignments?
Yes, we can according to Your Design Requirements of individual R & D.























Product Tags:

Heat Sink Silicone Thermal Pad

      

1.5W/MK Conductive Silicone Pad

      

Chip Cooling Heatsink Conductive Silicone Pad

      
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